K&S Wedge Wire Bonding

The Wire Bonder Ball is part of the equipment used in the bonding (electronic connection) process, primarily in the semiconductor industry, where electrical circuits are connected using thin wires. The "Ball" in Wire Bonder refers to a small ball at the end of the thin wire that connects the device (such as a semiconductor chip) to the substrate (such as a printed circuit board).In this process, very fine wires (such as gold or aluminum) are connected to electrical circuits using heat and pressure. The Ball is formed when the wire is fed through the wire bonder machine and forms a small ball, which is then bonded to the circuit through heating and pressure. The Wire Bonder Ball is critical in the bonding process, as it ensures a strong, stable, and efficient connection between circuits, especially in delicate chips and semiconductors.

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